Researchers in the United States have developed a photonic curing technique using laser sintering to improve the copper metallization of solar cells by reducing oxidation. This process produces dense, low-porosity copper layers with strong adhesion to indium tin oxide, achieving low bulk and contact resistivity. The technique allows for rapid, localized heating of copper pastes on temperature-sensitive substrates without causing thermal stress. The researchers aim to reduce copper consumption and improve the efficiency of solar cells through this innovative method, which is scalable and compatible with high-volume photovoltaic manufacturing. This new technique for solar cell manufacturing using photonic curing of copper inks could provide a pathway to scalable copper metallization for solar cells, as presented in a paper published in physica status solidi (PSS) by a research team including academics from the University of Delaware.